Samsung will reportedly not be using Qualcomm's Snapdragon 810 SoC inside the Galaxy S6 flagship that's expected to be unveiled at MWC 2015 at Barcelona in March.
Several reports have pointed to issues with the Snapdragon 810 chipset related to overheating - potentially delaying many flagship handsets. A more recent report also indicated Samsung would initially only release the Galaxy S6 with its own Exynos processor, before releasing the Qualcomm-variant in limited quantities.
On Wednesday however, a report by Bloomberg citing people with direct knowledge of the matter, claims that Samsung has decided not to use the Qualcomm Snapdragon 810 chipset due to overheating issues found during its testing.
A Qualcomm spokesman declined to comment on the Bloomberg report, while a Samsung spokeswoman said the company does not comment on rumours. Interestingly, Qualcomm has in the past repeatedly denied any issues or delays with the Snapdragon 810 chip. Other reports said the overheating issue had existed, but had been resolved and the company was mass producing the chips for the LG G Flex2 and Xiaomi Mi Note Pro, two handsets with the processor officially listed.
The launch dates of the two handsets indicate that at least LG seems to be facing no issues with the Snapdragon 810 processor, with the LG G Flex2 scheduled to go on sale in Korea by the end of the month.
The Xiaomi Mi Note Pro on the other hand will only enter mass production in early March, with the company claiming it has not yet received shipment from Qualcomm. Samsung's Galaxy S6, while expected to be unveiled at MWC, is also expected to go on sale a fair bit after.
Recent reports have indicated the Galaxy S6 will come with a iPhone-like fingerprint touch sensor instead of swipe-based, 4GB of RAM, and a much-improved and lightweight TouchWiz UI. The smartphone will likely come in two variants, one with a regular display and the other with a curved edge display seen in the Samsung Galaxy Note Edge.
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