Xiaomi Mi 5 Protective Case Unveiled Ahead of Smartphone's Launch

Xiaomi Mi 5 Protective Case Unveiled Ahead of Smartphone's Launch
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Xiaomi is following LG's lead. The Chinese company on Monday, apart from sending invites for its China event on February 24, also unveiled a protective case for the upcoming flagship smartphone - more than a week ahead of the Mi 5's smartphone.

Unfortunately, not much could be deciphered about the design of the Xiaomi Mi 5 by looking at the image of the transparent case. The company touts that the case has a thickness of 0.45 mm. The protective soft case of the Mi 5 will be unveiled alongside the handset on February 24. Xiaomi revealed the new case in a post on Weibo. To recall, LG had last week launched the LG G5 Quick Cover ahead of the G5 launch at MWC 2016.

(Also see: Xiaomi Mi 5 Price, Specifications, and Everything Else We Already Know)

Xiaomi earlier on Monday started sending invitation letters for the Mi 5 launch event in China National Convention Center on February 24. The company confirmed that the event would start at 11:30am IST. The Chinese invitation letter has the number 5 written in big fonts which is mainly for the Mi 5 smartphone. Last month, the Chinese company also announced a limited media preview at MWC 2016 in Barcelona on the same day to showcase the new Xiaomi Mi 5 flagship smartphone.

Some of the features that have been confirmed by Xiaomi include dual-SIM functionality; NFC connectivity, and Qualcomm Snapdragon 820 SoC under the hood.

Based on preliminary leaks, the Xiaomi Mi 5 specifications include a 5.2-inch display with either full-HD or QHD resolution. The handset is said to come in two memory and storage versions - 3GB of RAM with 32GB inbuilt storage, and 4GB of RAM with 64GB storage. On the camera front, the Mi 5 is rumoured to pack a 16-megapixel rear camera and a 13-megapixel front-facing camera. It is also supposed to be backed by a 3600mAh battery with Quick Charge 3.0 tech. The Chinese company is also said to use a pressure-sensitive touchscreen, which will be a technology similar to Apple's 3D Touch-like pressure sensitive technology.

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