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iPhone 5s teardown provides a look inside Apple's new phone

iPhone 5s teardown provides a look inside Apple's new phone

By Reuters | Updated: 20 September 2013 17:03 IST

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Apple Inc's newest smartphone models hit stores on Friday in many countries across the world, including Australia and China. The gadget giant for the first time is selling a second smartphone dubbed "5c" featuring a plastic back and bright colors. The pricier "5s" now comes in three new colors - gray, silver and gold.

(Also see: Apple unveils iPhone 5c and iPhone 5s)

Technology firm iFixit disassembled a gold-colored iPhone and examined its parts. Following are some of the key components for the iPhone 5s (Review) and their makers that have been identified so far:

Chips from Avago, Skyworks Solutions are featured in the new iPhone. Companies supplying parts for the new phone also include memory chipmaker Hynix and radio-frequency chipmaker Triquint.
The new fingerprint sensor uses a chip from NXP Semiconductors.
There is no single M7 motion co-processor, a new chip that Apple said was part of the iPhone 5s when it unveiled the device last week. The M7 appears to be more a collection of chips, including chips for a gyroscope, accelerometer and compass, iFixit said.
Broadcom's BCM5976 chip is used for touchscreen controller. Murata Manufacturing Co's 339S0205 (based on the Broadcom BCM4334) is used in Wi-Fi module.
Includes chips from Qualcomm Inc (PM8018 RF power management IC) and Texas Instruments Inc.

(Also see: 10 new features in Apple's iPhone 5s)

Information is from iFixit, a Web site offering parts and self-repair guides for iPods and Macintosh computers. The company, which has conducted similar "tear downs" on other Apple products, posted step-by-step photos of the process on its Website.

iPhone 5c and iPhone 5s launch in pictures